China Digest: IC chip designer Nurlink bags $29m; BoCloud raises funds

China Digest: IC chip designer Nurlink bags $29m; BoCloud raises funds

Photographer: Tomohiro Ohsumi/Bloomberg

Nurlink Technology has closed a 200 million yuan ($29 million) Series B round from CICC Capital’s sub-fund CICC Qihong and others, while BoCloud has secured an undisclosed Series D round from Oriental Fortune Capital, and others.